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33970 Datasheet(PDF) 7 Page - Freescale Semiconductor, Inc |
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33970 Datasheet(HTML) 7 Page - Freescale Semiconductor, Inc |
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7 / 36 page ![]() Analog Integrated Circuit Device Data Freescale Semiconductor 7 33970 ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 4. Dynamic Electrical Characteristics Characteristics noted under conditions 4.75 V < VDD < 5.25 V, -40°C < TA < 125°C, GND = 0 V unless otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted. Characteristic Symbol Min Typ Max Unit POWER OUTPUT AND CLOCK TIMINGS SIN, COS Output Turn ON Delay Time (Time from Rising CS Enabling Outputs to Steady State Coil Voltages and Currents) (14) tDLY(ON) – – 1.0 ms SIN, COS Output Turn OFF Delay Time (Time from Rising CS Disables Outputs to Steady State Coil Voltages and Currents) (14) tDLY(OFF) – – 1.0 ms Uncalibrated Oscillator Cycle Time tCLU 0.65 1.0 1.7 µs Calibrated Oscillator Cycle Time Cal Pulse = 8.0 µs, PECCR D4 = Logic [0] Cal pulse = 8.0 µs, PECCR D4 = Logic [1] tCLC 1.0 0.9 1.1 1.0 1.2 1.1 µs Maximum Pointer Speed (15) VMAX – – 400 °/s Maximum Pointer Acceleration (15) AMAX – – 4500 °/s2 SPI INTERFACE TIMING (16) Recommended Frequency of SPI Operation fSPI – 1.0 3.0 MHz Falling Edge of CS to Rising Edge of SCLK (Required Setup Time) (17) tLEAD – 50 167 ns Falling Edge of SCLK to Rising Edge of CS (Required Setup Time) (17) tLAG – 50 167 ns SI to Falling Edge of SCLK (Required Setup Time) (17) tSISU – 25 83 ns Required High State Duration of SCLK (Required Setup Time) (17) tWSCLKH – – 167 ns Required Low State Duration of SCLK (Required Setup Time) (17) tWSCLKL – – 167 ns Falling Edge of SCLK to SI (Required Hold Time) (17) tSI(HOLD) – 25 83 ns SO Rise Time CL = 200 pF tRSO – 25 50 ns SO Fall Time CL = 200 pF tFSO – 25 50 ns SI, CS, SCLK, Incoming Signal Rise Time (18) tRSI – – 50 ns SI, CS, SCLK, Incoming Signal Fall Time (18) tFSI – – 50 ns Falling Edge of RST to Rising Edge of RST (Required Setup Time) (17) tWRST – – 3.0 µs Rising Edge of CS to Falling Edge of CS (Required Setup Time) (17), (19) tCS – – 5.0 µs Rising Edge of RST to Falling Edge of CS (Required Setup Time) (17) tEN – – 5.0 µs Notes 14. Maximum specified time for the 33970 is the minimum guaranteed time needed from the microcontroller. 15. The minimum and maximum value will vary proportionally to the internal clock tolerance. These numbers are based on an ideally calibrated clock frequency of 1.0 MHz. These are not 100 percent tested. 16. The device shall meet all SPI interface timing requirements specified in the SPI Interface Timing section of this table, over the temperature range specified. Digital interface timing is based on a symmetrical 50 percent duty cycle SCLK Clock Period of 333 ns. The device shall be fully functional for slower clock speeds. See Figure 4 and 5. 17. The maximum setup time specified for the 33970 is the minimum time needed from the microcontroller to guarantee correct operation. 18. Rise and Fall time of incoming SI, CS, and SCLK signals suggested for design consideration to prevent the occurrence of double pulsing. 19. The value is for a 1.0 MHz calibrated internal clock. The value will change proportionally as the internal clock frequency changes |
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