| Electronic Components Datasheet Search |
|
PI3033B Datasheet(PDF) 3 Page - AMI SEMICONDUCTOR |
|
|
|||||||||||||||||||||||||||||
PI3033B Datasheet(HTML) 3 Page - AMI SEMICONDUCTOR |
|
3 / 13 page ![]() Preliminary PI3033B datasheet Bonding Pad Outputs Locations and Die Dimensions Figure 2 shows image sensors die dimension and the bonding pad locations for PI3033B Sensor Chip. The location is referenced to the lower left corner of the die. Note RSTLV, bias, pad is not used. Figure 2. Bonding Pad and Chip Layout: Page 3 of 13 Date: 03/18/05 |
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |