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PI3041A Datasheet(PDF) 2 Page - AMI SEMICONDUCTOR

Part # PI3041A
Description  Contact Image Sensor 300DPI CIS Sensor Chip
PDF  18 Pages
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Manufacturer  AMI [AMI SEMICONDUCTOR]
Direct Link  http://www.amis.com
Logo AMI - AMI SEMICONDUCTOR

PI3041A Datasheet(HTML) 2 Page - AMI SEMICONDUCTOR

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Preliminary PI3041A datasheet
PI3041A
300DPI CIS Sensor Chip
Engineering Data Sheet
Description:
Peripheral Imaging Corporation PI3041A CIS, Contact Image Sensor, chip is a 300 dot per
inch resolution, linear array image sensor chip. The sensor chip is processed using a CMOS
Image Sensing Technology, a possession of ISPL (Image Sensor Product Line) group within
AMIS. Designed for cascading multiple chips in a series, the image sensor chips, uses a chip-
on-board process. They are bonded end-to-end on a printed circuit board (PCB). This
bonding process allows the CIS module manufacturers to produce variable CIS module
lengths in increments of the chip array lengths. Hence, the modules are easily applied in a
large number of document scanners, found in today’s facsimile market. Examples are wide
format maps and architectural drawings scanners down to the narrow width scanners, such
as, those found in check readers, lotto tickets, entrance gates tickets, etc. This is not to
exclude the many office automation equipments, which require an even more variety in
scanning widths, as well as, those with special mechanically configurations.
Figure 1 is a block diagram of the imaging sensor chip. Each sensor chip consists of 96 detector
elements, their associated multiplexing switches, buffers, and a chip selector. The detector's
element-to-element spacing is approximately 83.3 µm. The size of each chip without scribe lines is
8080 µm by 380 µm. Each sensor chip has 7 bonding pads. The pad symbols and functions are
described in Table 1.
8080 µm
380 µm
Row of 96 Sensors
and Video Signal
Multiplexers
Readout Shift Register
Buffer
Buffer
Chip
Select
Buffer
SP
CP VDD DGND
IOUT
AGND EOS
Figure 1. PI3041A Block Diagram
SYMBOL
FUNCTION
SP
Start Pulse: Input clock to start the line scan.
CP
Clock Pulse: Input clock to clock of the Shift Register.
VDD
Positive Supply: +5 volt supply connected to substrate.
DGND
Digital Ground: Connection topside common
IOUT
Signal Current Output: Output for video signal current
AGND
Analog Ground: Connection topside common
EOS
End of Scan Pulse: Output from the shift register at end of scan.
Table 1. Pad Symbols and Functions
Page 2 of 18 Date: 09/23/05



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