PI6050D Data Sheet

_________________________________________________________________________________________

Bonding Pad Layout Diagram

Figure 2 shows the bonding pad locations for the PI6050D sensor.

X

Y

X

Y

CLK

GBST

SIC

SI

425µm

GBST

SI

VDD

SIC

CLK

VSS

VOUT

VR

SO

SC

SC

14560µm

Pad Location Table

Location

Global Start Pulse

Start Input Control

Start Pulse

Clock

Switch Control

VDD

VOUT

VSS

VREF

SO

Power Supply

Video Output Voltage

Ground

Reference Voltage

End of Scan Pulse

Pad

30

30

30

34

30

34

30

30

30

30

13259

10549

10909

5820

4945

5414

4590

3442

4199

1000

SI

3. Pad locations are listed in the Pad Location Table

in the above sensor die figure

2. The die length and width are given

1. The drawing is not to scale.

X

4. Each pad is 120 x 80um

5. All dimensions are in um

6. Die size does not include the scribe line

Y

eg.

X

Notes:

GBST

X

Figure 2. PI6050D Bonding Pad Layout

Wafer Scribe Line

Figure 3 outlines the scribe line dimensions surrounding the sensor die on a wafer.

60µm

60µm

55µm

55µm

15µm

425µm

14560µm

Figure 3. Wafer Scribe Line

Page 5 of 15, PI6050D_rev A, Revised 1-31-05