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M65KA512AB Datasheet(PDF) 1 Page - STMicroelectronics |
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M65KA512AB Datasheet(HTML) 1 Page - STMicroelectronics |
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1 / 55 page ![]() March 2007 Rev 3 1/55 1 M65KA512AB 512Mbit (4 Banks x 8M x 16), 133 MHz Clock Rate, Bare Die, 1.8 V Supply, Low Power SDRAM Features ■ 512 Mbit Synchronous Dynamic Ram – Organized as 4 Banks of 8 Mwords, each 16 bits wide ■ Supply voltage –VDD = 1.7 to 1.9 V (1.8 V typical in accordance with JEDEC standard) –VDDQ = 1.7 to 1.9 V for Input/Output ■ Synchronous Burst Read and Write – Fixed Burst Lengths: 1, 2, 4, 8 words or Full Page – Burst Types: Sequential and Interleaved. – Clock Frequency: 133 MHz (7.5 ns speed class) – Clock Valid to Output Delay (CAS Latency): 3 at 133 MHz – Burst Control by Burst Terminate and Precharge Command ■ Automatic and controlled Precharge ■ Byte control by LDQM and UDQM ■ Low-power features: – Partial Array Self Refresh (PASR), – Automatic Temperature Compensated Self Refresh (TCSR) – Driver Strength (DS) – Deep Power-Down Mode ■ Auto Refresh and Self Refresh ■ LVCMOS Interface compatible with multiplexed addressing ■ Operating temperature range – − 30to 85 °C M65KA512AB is only available as part of a multiple memory product Wafer www.st.com |
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