TC1264_06 datasheet(3/18 Pages) MICROCHIP

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DS21375C-page 3

TC1264

Thermal Regulation

ΔVOUT/ΔPD

—0.04

—

V/W

Note 7

Output Noise

—

260

—

nV/

√Hz IL = IOUTMAX, F = 10 kHZ

DC CHARACTERISTICS (CONTINUED)

Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.5V, (Note 1), IL = 100 µA, CL = 3.3 µF, SHDN > VIH,

TA = +25°C. Boldface type specifications apply for junction temperatures of -40°C to +125°C.

Parameters

Sym

Min

Typ

Max

Units

Conditions

Note 1:

VR is the regulator output voltage setting.

2: The minimum VIN has to justify the conditions: VIN ≥ VR + VDROPOUT and VIN ≥ 2.7V for IL = 0.1 mA to IOUTMAX.

This accuracy represents the worst-case over the entire output current and temperature range.

Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested

over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating

effects are covered by the thermal regulation specification.

Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal

value measured at a 1.5V differential.

Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,

excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms.

The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction tem-

perature and the thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dis-

sipation causes the device to initiate thermal shutdown. Please see Section 5.0 “Thermal Considerations” for more

details..

TCVOUT

VOUTMAX VOUTMIN

–

() 10

–

VOUT

-------------------------------------------------------------------------

TEMPERATURE CHARACTERISTICS

Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.5V, IL = 100 µA, CL = 3.3 µF, SHDN > VIH, TA = +25°C.

Parameters

Sym

Min

Typ

Max

Units

Conditions

Temperature Ranges

Specified Temperature Range

-40

—

+125

°C

(Note 1)

Operating Temperature Range

-40

—

+125

°C

Storage Temperature Range

-65

—

+150

°C

Thermal Package Resistances

Thermal Resistance, 3L-SOT-223

θJA

—59

—

°C/W

Thermal Resistance, 3L-DDPAK

θJA

—71

—

°C/W

Thermal Resistance, 3L-TO-220

θJA

—71

—

°C/W

Note 1:

Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+125°C).

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