KB4863 datasheet(6/19 Pages) KINGBOR

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Typical Performance Characteristics

MTE Specific Characteristics (Continued)

KB4863MTE (Note 17)

Power Derating Curve

Note 17: This curve shows the KB4863MTE’s thermal dissipation ability at different ambient temperatures given these conditions:

500LFPM + JEDEC board: The part is soldered to a 1S2P 20-lead exposed-DAP TSSOP test board with 500 linear feet per minute of forced-air flow across it.

Board information - copper dimensions: 74x74mm, copper coverage: 100% (buried layer) and 12% (top/bottom layers), 16 vias under the exposed-DAP.

500LFPM + 2.5in2: The part is soldered to a 2.5in2, 1 oz. copper plane with 500 linear feet per minute of forced-air flow across it.

2.5in2: The part is soldered to a 2.5in2, 1oz. copper plane.

Not Attached: The part is not soldered down and is not forced-air cooled.

Non-MTE Specific Characteristics

THD+N vs Frequency

THD+N vs Output Power

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KB4863

6/19

Rev: 1.1

2005-12-05

KB4863 Datasheet(PDF) 6 Page - Kingbor Technology Co

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