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H838024R Datasheet(PDF) 57 Page - Renesas Technology Corp |
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H838024R Datasheet(HTML) 57 Page - Renesas Technology Corp |
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57 / 697 page ![]() Section 1 Overview Rev. 7.00 Mar 10, 2005 page 15 of 652 REJ09B0042-0700 63 61 59 57 55 53 51 49 47 45 43 62 60 58 56 54 52 50 48 46 44 42 81 79 77 75 73 71 69 67 65 80 78 76 74 72 70 68 66 64 1 3 5 7 9 11 13 15 17 19 21 23 2 4 6 8 10 12 14 16 18 20 22 24 26 25 28 30 32 34 36 38 40 27 29 31 33 35 37 39 41 Y X (0, 0) Type code Chip size: 3.84 mm × 4.24 mm Voltage level on the back of the chip: GND : NC pad Figure 1.6 Bonding Pad Location Diagram of HCD64F38024, HCD64F38024R (Top View) |
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