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TLV75533PDBVR Datasheet(PDF) 21 Page - Texas Instruments

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Part # TLV75533PDBVR
Description  TLV755P 500mA, Low-IQ, Small-Size, Low-Dropout Regulator
PDF  49 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TLV75533PDBVR Datasheet(HTML) 21 Page - Texas Instruments

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7.4 Layout
7.4.1 Layout Guidelines
• Place input and output capacitors as close as possible to the device.
• Use copper planes for device connections to optimize thermal performance.
• Place thermal vias around the device to distribute the heat.
• For packages with thermal pads, solder the thermal pad to copper to achieve best thermal resistance.
Thermal resistance increases significantly when the thermal pad is not soldered.
7.4.2 Layout Examples
OUT
IN
GND PLANE
Represents via used for application
specific connections
1
2
3
4
C
IN
C
OUT
EN
Figure 7-6. Layout Example for the DQN Package
VOUT
VIN
GND PLANE
Represents via used for
application specific connections
1
2
3
4
5
C
OUT
C
IN
EN
Figure 7-7. Layout Example for the DBV Package
VIN
VOUT
GND PLANE
Represents via used for
application specific connections
1
2
3
4
6
C
IN
C
OUT
EN
5
Figure 7-8. Layout Example for the DRV Package
www.ti.com
TLV755P
SBVS320D – NOVEMBER 2017 – REVISED SEPTEMBER 2024
Copyright © 2024 Texas Instruments Incorporated
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Product Folder Links: TLV755P



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