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EMC1412 Datasheet(PDF) 39 Page - Microchip Technology |
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EMC1412 Datasheet(HTML) 39 Page - Microchip Technology |
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39 / 46 page ![]() 2014-2022 Microchip Technology Inc. and its subsidiaries DS20005273B-page 39 EMC1412 RECOMMENDED LAND PATTERN Dimension Limits Units Optional Center Pad Width Optional Center Pad Length Contact Pitch Y2 X2 1.70 1.50 MILLIMETERS 0.50 BSC MIN E MAX Contact Pad Length (X8) Contact Pad Width (X8) Y1 X1 0.69 0.28 Microchip Technology Drawing C04-2382A NOM 8-Lead Very Thin Plastic Dual Flat, No Lead Package (8Q) - 2x3 mm Body [VDFN] SILK SCREEN C Contact Pad Spacing 2.84 Space Between Pads G1 0.20 Thermal Via Diameter V Thermal Via Pitch EV 0.30 1.00 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process 1. 2. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: C X1 Y1 EV EV X2 Y2 ØV E G1 Contact Pad to Center Pad (X8) (G2) 0.225 REF (G2) 12 8 |
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