data sheet

PSvfBGA

Features:

Reliability:

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• 10-15 mm body sizes tooled per product table. Additional

sizes based on demand

• Top package I/O interface 0.65 mm pitch accommodating 104

to 160 pin counts

• High I/O 0.50 mm pitch interface is qualified

• Fine pitch 0.50 mm bottom package footprints with 0.40 mm

pitch in qualification

• Established package on package infrastructure (over 5 years of

development with leading OEM, EMS and equipment providers)

• Consistent product performance and reliability

•Package configurations compliant with JEDEC standards

• Package pre-stacking support and services available based

on demand

• Bottom PSvfBGA and top FBGA / Stacked CSP packages

are well established in high volume production

• Stacked package heights of 1.2 mm to 1.6 mm available

in a variety of configurations. (See Stack Up table below)

Amkor assures reliable performance by continuously

monitoring key indices:

Package Level:

• Moisture Resistance Testing JEDEC Level 3 @260 °C x 4 reflows

• Additional Test Data at [(30 °C/85%RH/96hrs)+260]x3 or x4

• Package dimensions

14 x 14 mm, 352 I/O

• Temp Cycle

-55/+125 °C, 1000 cycles

• Temp/Humidity

85 °C/85%RH/1000 hours

• High Temp Storage

150 °C, 1000 hours

• HAST

130 °C, 85% RH, 96 hours

Board Level:

• Thermal Cycle

-40/+125 °C, 1000 cycles

Package Stackable Very Thin Fine

Pitch BGA (PSvfBGA):

After 3 years of development in package stacking technology and infra-

structure, Amkor launched the multiple award winning PSvfBGA (base

PoP) platform during the 4th quarter of 2004. The next two years saw

many new milestones, from publication of JEDEC mechanical and elec-

trical standards to a range of new customers and applications adopting

PoP. By the end of 2006 PSvfBGA became the fastest growing new

product in Amkor's history, reflecting the broad industry benefits of PoP

and Amkor's leadership position. The next few years promise to provide

many new challenges and applications for PoP, as handheld multimedia

applications continue to demand higher processing power and memory

storage capacities. Amkor is committed to maintain strong development

and production capabilities to ensure we are forefront in meeting next

generation PoP requirements.

Amkor has expanded our comprehensive PoP family and aligned the

roadmap across the supply chain to ensure that PoP will continue to

scale with the industry's miniaturization, higher density and perform-

ance enhancement requirements.

In 2006 Amkor's PoP family ramped products with 2 die stacked in the

PSvfBGA platform. Stacking multiple die in the bottom package allows

customers to increase performance and provide further system miniatur-

ization by combining analog+digital or logic+memory devices.

Applications:

PoP packages are designed for products requiring efficient memory

architectures including multiple buses and increased memory density &

performance, while reducing mounted area. Portable electronic products

such as mobile phones (baseband or applications processor+combo

memory), digital cameras (image processor+memory), PDAs, portable

players (audio / graphics processor+memory), gaming and other

mobile applications can benefit from the combination of stacked pack-

age and small footprint offered by Amkor's industry leading PoP family.

Broad Benefits as an Enabling

Technology:

PoP offers OEMs and EMS providers a platform to cost effectively expand

options for logic+memory 3D integration with the following benefits:

• Greatly expands device options by simplifying the business logistics

of stacking

• Integration controlled at the system level to best match stacked

combinations with system requirements

• JEDEC standards ensure broad component availability

• Improving time to market and sourcing flexibility

• Eliminates margin stacking and expands technology reuse

• Helps manage the huge cost impacts associated with increasing

demand for multi-media processing and memory

• Logic device transitions to flip chip in the bottom package enables

further PoP size and height reductions

DS586C

Rev Date: 03’07

VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND

TO VIEW THE MOST CURRENT PRODUCT INFORMATION

.

LAMINATE

FBGA + PSvfBGA

Symbol

Unit

Min

Max

Nom

A1 (mounted, 0.5 pitch)

mm

0.160

0.260

0.210

A2 (4L laminate)

mm

0.260

0.340

0.300

B1 (stacked, 0.65 pitch), single die mm

0.270

0.330

0.300

B2 (stacked, 0.65 pitch), 2+0 die mm

0.320

0.380

0.350

B3 (2L laminate)

mm

0.100

0.160

0.130

B4 (mold cap)

mm

0.370

0.430

0.400

Overall Pkg height

mm

1.310

1.470

1.400

PoP Overall Stack Up Table

Package on Package (PoP) Family