Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

SC4510ITSTRT Datasheet(PDF) 15 Page - Semtech Corporation

Part # SC4510ITSTRT
Description  High Performance Synchronous Buck Controller With Reference Tracking
PDF  16 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  SEMTECH [Semtech Corporation]
Direct Link  http://www.semtech.com
Logo SEMTECH - Semtech Corporation

SC4510ITSTRT Datasheet(HTML) 15 Page - Semtech Corporation

Back Button SC4510ITSTRT Datasheet HTML 8Page - Semtech Corporation SC4510ITSTRT Datasheet HTML 9Page - Semtech Corporation SC4510ITSTRT Datasheet HTML 10Page - Semtech Corporation SC4510ITSTRT Datasheet HTML 11Page - Semtech Corporation SC4510ITSTRT Datasheet HTML 12Page - Semtech Corporation SC4510ITSTRT Datasheet HTML 13Page - Semtech Corporation SC4510ITSTRT Datasheet HTML 14Page - Semtech Corporation SC4510ITSTRT Datasheet HTML 15Page - Semtech Corporation SC4510ITSTRT Datasheet HTML 16Page - Semtech Corporation  
Zoom Inzoom in Zoom Outzoom out
 15 / 16 page
background image
15
© 2004 Semtech Corp.
www.semtech.com
SC4510
POWER MANAGEMENT
Application Information (Contd.)
PCB LAYOUT FOR SC4510
Careful attention to layout requirements is necessary for
successful implementation of the SC4510 PWM controller.
High switching currents with fast rise and fall times are
present in the application and their effect on ground plane
voltage differentials must be understood and minimized.
A good layout with minimum parasitic loop areas will
a) reduce EMI
b) lower ground injection currents, resulting in electrically
“cleaner” grounds for the rest of the system and
c) minimize source ringing, resulting in more reliable gate
switching signals.
LAYOUT GUIDELINES
In the following Q
T and QB denote the high side and low
side MOSFETs respectively.
1) A ground plane should be used. The number and position
of ground plane interruptions should be minimised so as
not to compromise ground plane integrity. Isolated or semi-
isolated areas of the ground plane may be deliberately
introduced to constrain ground currents into particular
paths, such as the output capacitor or the Q
B source.
2) The high power, high current parts of the circuit should
be laid out first. The on time loop formed by the input
capacitor Cin, the high side FET Q
T, the output inductor and
the output capacitor bank Cout must be kept as small as
possible. Another loop area to minimise is formed by low
side FET Q
B, the output inductor and the output capacitor
bank Cout during the off period. These loops contain all
the high current, fast transition switching. Connections
should be as wide and as short as possible to minimize
loop inductance.
3) The connection between the junction of Q
T, QB and the
output inductor should be a wide trace or copper region. It
should be as short as practical. Since this connection has
fast voltage transitions, keeping this connection short will
minimize EMI. Also keep the Phase connection to the IC
short. The top FET gate charge currents flow in this trace.
4) The output capacitor Cout should be located as close to
the load terminals as possible. Fast transient load currents
are supplied by Cout and connections between Cout and
the load must be kept short with wide copper areas to
minimize inductance and resistance. This will improve the
transient response to step loads.
5) The SC4510 is best placed over a quiet ground plane
area. Avoid pulse currents of the Cin, Q
T, QB loop flowing in
this area. This analog ground plane should be connected
to the power ground plane at a “quiet” point near the input
capacitor. Under no circumstance should it be returned to
a point inside the Cin, Q
T, QB, Cout power ground loops.
6) The SC4510 AGND pin is connected to the separate
analog ground plane with minimum lead length . All analog
grounding paths including decoupling capacitors, feedback
resistors, compensation components, soft start capacitor,
frequency and current-limit setting resistors should be
connected to the same plane.
7) Locate the critical filtering capacitors as close as possible
to their respective device. This is particularly true for the
current feedback filtering capacitor connected between
CS+ and CS-. A high value ceramic capacitor is also
recommended between PVCC and PGND pins close to the
device.



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16


Datasheet Download

Go To PDF Page


Link URL



Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Contact us   |   Privacy Policy   |   Link to Datasheet    |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com