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SC4510ITSTRT Datasheet(PDF) 15 Page - Semtech Corporation |
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SC4510ITSTRT Datasheet(HTML) 15 Page - Semtech Corporation |
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15 / 16 page ![]() 15 © 2004 Semtech Corp. www.semtech.com SC4510 POWER MANAGEMENT Application Information (Contd.) PCB LAYOUT FOR SC4510 Careful attention to layout requirements is necessary for successful implementation of the SC4510 PWM controller. High switching currents with fast rise and fall times are present in the application and their effect on ground plane voltage differentials must be understood and minimized. A good layout with minimum parasitic loop areas will a) reduce EMI b) lower ground injection currents, resulting in electrically “cleaner” grounds for the rest of the system and c) minimize source ringing, resulting in more reliable gate switching signals. LAYOUT GUIDELINES In the following Q T and QB denote the high side and low side MOSFETs respectively. 1) A ground plane should be used. The number and position of ground plane interruptions should be minimised so as not to compromise ground plane integrity. Isolated or semi- isolated areas of the ground plane may be deliberately introduced to constrain ground currents into particular paths, such as the output capacitor or the Q B source. 2) The high power, high current parts of the circuit should be laid out first. The on time loop formed by the input capacitor Cin, the high side FET Q T, the output inductor and the output capacitor bank Cout must be kept as small as possible. Another loop area to minimise is formed by low side FET Q B, the output inductor and the output capacitor bank Cout during the off period. These loops contain all the high current, fast transition switching. Connections should be as wide and as short as possible to minimize loop inductance. 3) The connection between the junction of Q T, QB and the output inductor should be a wide trace or copper region. It should be as short as practical. Since this connection has fast voltage transitions, keeping this connection short will minimize EMI. Also keep the Phase connection to the IC short. The top FET gate charge currents flow in this trace. 4) The output capacitor Cout should be located as close to the load terminals as possible. Fast transient load currents are supplied by Cout and connections between Cout and the load must be kept short with wide copper areas to minimize inductance and resistance. This will improve the transient response to step loads. 5) The SC4510 is best placed over a quiet ground plane area. Avoid pulse currents of the Cin, Q T, QB loop flowing in this area. This analog ground plane should be connected to the power ground plane at a “quiet” point near the input capacitor. Under no circumstance should it be returned to a point inside the Cin, Q T, QB, Cout power ground loops. 6) The SC4510 AGND pin is connected to the separate analog ground plane with minimum lead length . All analog grounding paths including decoupling capacitors, feedback resistors, compensation components, soft start capacitor, frequency and current-limit setting resistors should be connected to the same plane. 7) Locate the critical filtering capacitors as close as possible to their respective device. This is particularly true for the current feedback filtering capacitor connected between CS+ and CS-. A high value ceramic capacitor is also recommended between PVCC and PGND pins close to the device. |
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