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SC4612STRT Datasheet(PDF) 16 Page - Semtech Corporation |
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SC4612STRT Datasheet(HTML) 16 Page - Semtech Corporation |
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16 / 24 page ![]() 16 2007 Semtech Corp. www.semtech.com SC4612 POWER MANAGEMENT that the stored charge on the bottom FET body diode will be moved through the top FET as it starts to turn on. The resulting power dissipation in the top FET will be: OSC IN RR RR f V Q P ⋅ ⋅ = To a first order approximation, it is convenient to only consider conduction losses to determine FET suitability. For a 5V in, 2.8V out at 14.2A requirement, typical FET losses would be: e p y T T E FR ) n o ( S D m ( Ω)) W ( D Pe g a k c a P S 2 0 4 3 L R I5 19 6 . 1D2 K A P 3 0 2 2 L R I5 . 0 19 1 . 1D2 K A P 0 1 4 4 i S0 26 2 . 28 - O S Using 1.5X Room temp R DS(ON) to allow for temperature rise. BOTTOM FET - Bottom FET losses are almost entirely due to conduction. The body diode is forced into conduction at the beginning and end of the bottom switch conduction period, so when the FET turns on and off, there is very little voltage across it resulting in very low switching losses. Conduction losses for the FET can be determined by: ) D 1 ( R I P ) on ( DS 2 O COND − ⋅ ⋅ = For the example above: e p y T T E FR ) n o ( S D m ( Ω)P D ) W (e g a k c a P S 2 0 4 3 L R I5 13 3 . 1D2 K A P 3 0 2 2 L R I5 . 0 13 9 . 0D2 K A P 0 1 4 4 i S0 27 7 . 18 - O S Each of the package types has a characteristic thermal impedance, for the TO-220 package, thermal impedance is mostly determined by the heatsink used. For the surface mount packages on double sided FR4, 2 oz printed circuit board material, thermal impedances of 40oC/W for the D2PAK and 80oC/W for the SO-8 are readily achievable. The corresponding temperature rise is detailed below: ( e s i r e r u t a r e p m e T 0 ) C e p y T T E FT E F p o TT E F m o t t o B S 2 0 4 3 L R I6 . 7 62 . 3 5 3 0 2 2 L R I6 . 7 42 . 7 3 0 1 4 4 i S8 . 0 8 16 . 1 4 1 It is apparent that single SO-8 Si4410 are not adequate for this application, By using parallel pairs in each position, power dissipation will be approximately halved and temperature rise reduced by a factor of 4. INPUT CAPACITORS - Since the RMS ripple current in the input capacitors may be as high as 50% of the output current, suitable capacitors must be chosen accordingly. Also, during fast load transients, there may be restrictions on input di/dt. These restrictions require useable energy storage within the converter circuitry, either as extra output capacitance or, more usually, additional input capacitors. Choosing low ESR input capacitors will help maximize ripple rating for a given size. Application Information (Cont.) |
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