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SC470ITSTRT Datasheet(PDF) 16 Page - Semtech Corporation |
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SC470ITSTRT Datasheet(HTML) 16 Page - Semtech Corporation |
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16 / 31 page ![]() 16 2005 Semtech Corp. www.semtech.com SC470 POWER MANAGEMENT Application Information (Cont.) Figure 7 below shows recommended components that work well. Figure 7: Recommended Component Values Please see the example switching waveforms on Pages 25 and 26. Thermal Considerations The junction temperature of the device may be calculated as follows: C P T T JA D A J ° θ • + = Where: T A = ambient temperature (°C) P D = power dissipation in (W) θ JA = thermal impedance junction to ambient from absolute maximum ratings (°C/W) The power dissipation may be calculated as follows: W D mA 1 VBST f Q V I VDDP I VCCA P g g VDDP VCCA D • • + • • + • + • = Where: VCCA = chip supply voltage (V) I VCCA = operating current (A) VDDP = gate drive supply voltage (V) I VDDP = gate drive operating current (A) V g = gate drive voltage, typically 5V (V) Q g = FET gate charge, from the FET datasheet (C) f = switching frequency (kHz) VBST = boost pin voltage during t ON (V) D = duty cycle Inserting the following values for VBAT (MIN) condition (since this is the worst-case condition for power dissipation in the controller) as an example (VOUT = 1.2V): T A = 85°C θ JA = 100°C/W (For TSSOP-14) θ JA = 46°C/W (For MLPQ-16) VCCA = VDDP = 5V I VCCA = 1100µA (data sheet maximum) I VDDP = 150µA (data sheet maximum) V g = 5V Q g = 60nC f = 266kHz VBAT (MIN) = 8V VBST (MIN) = VBAT(MIN)+VDDP = 13V D (MIN) = 1.2/8 = 0.15 gives us: W 088 . 0 15 . 0 10 1 13 10 266 10 60 5 10 150 5 10 1100 5 P 3 3 9 6 6 D = • • • + • • • • + • • + • • = − − − − So for TSSOP-14, C 8 . 93 100 088 . 0 85 T J ° = • + = And for MLPQ-16, C 0 . 89 46 088 . 0 85 TJ ° = • + = As can be seen, the heating effects due to internal power dissipation are practically negligible, thus requiring no special consideration thermally during layout. Q3 R8 10k C11 22n R9 1k VGATE VPULLUP |
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