www.ti.com

ABSOLUTE MAXIMUM RATINGS

DISSIPATION RATINGS

TPS775xx, TPS776xx

SLVS232I – SEPTEMBER 1999 – REVISED AUGUST 2007

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be

more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

PRODUCT

(2)

TPS775xxyyyz, TPS776xxyyyz

XX is nominal output voltage (for example, 28 = 2.8V, 285 = 2.85V, 01 = Adjustable).

YYY is package designator.

Z is package quantity.

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

(2)

Custom fixed output voltages are available; minimum order quantities may apply. Contact factory for details and availability.

Over operating temperature range (unless otherwise noted)

(1)

PARAMETER

TPS775xx, TPS776xx

UNIT

(2)

–0.3 to +13.5

V

Voltage range at EN

–0.3 to +16.5

V

Maximum RESET voltage (TPS775xx)

16.5

V

Maximum PG voltage (TPS776xx)

16.5

V

Peak output current

Internally limited

Voltage range at OUT, FB

7

V

Continuous total power dissipation

See Dissipation Ratings Table

–40 to +125

°C

–65 to +150

°C

ESD rating, HBM

2

kV

(1)

Stresses above these ratings may cause permanent damage to the device. Exposure to absolute maximum conditions for extended

periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other

conditions beyond those specified is not implied.

(2)

All voltages are with respect to network terminal ground.

AIRFLOW

DERATING FACTOR

BOARD

PACKAGE

(CFM)

0

568mW

5.68mW/

°C

312mW

227mW

—

D

250

904mW

9.04mW/

°C

497mW

361mW

0

2.9mW

23.5mW/

°C

1.9W

1.5W

PWP

300

4.3mW

34.6mW/

°C

2.8W

2.2W

0

3W

23.8mW/

°C

1.9W

1.5W

PWP

300

7.2W

57.9mW/

°C

4.6W

3.8W

(1)

This parameter is measured with the recommended copper heat sink pattern on a 1-layer, 5in

נ

5in printed circuit board (PCB), 1-ounce

copper, 2in

נ

(2)

This parameter is measured with the recommended copper heat sink pattern on a 8-layer, 1.5in

נ

2in PCB, 1-ounce copper with layers 1,

SLMA002.

2

Submit Documentation Feedback