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FSL336LR Datasheet(PDF) 4 Page - ON Semiconductor

Part # FSL336LR
Description  Green Mode onsemi Buck
PDF  14 Pages
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

FSL336LR Datasheet(HTML) 4 Page - ON Semiconductor

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FSL336LR
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ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise specified)
Symbol
Parameter
Min
Max
Unit
VDS
Drain Pin Voltage
−0.3
650.0
V
VCC
Supply Voltage
−0.3
26.0
V
VCOMP
VCOMP Pin Voltage
−0.3
Internally Clamped Voltage (Note 1)
V
VFB
Feedback Voltage
−0.3
12.0
V
ILIMIT
Current Limit Pin Voltage
−0.3
12.0
V
IDM
Drain Current Pulsed (Note 2)
−
12
A
EAS
Single Pulsed Avalanche Energy (Note 3)
−
230
mJ
PD
Total Power Dissipation
−
1.25
W
TJ
Operating Junction Temperature (Note 4)
−40
125
°C
Maximum Junction Temperature
−
150
°C
TSTG
Storage Temperature
−55
150
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. VCOMP is clamped by internal clamping diode (11 V, ICLAMP_MAX < 100 mA).
2. Repetitive rating: pulse width is limited by maximum junction temperature.
3. L = 51 mH, starting TJ = 25°C.
4. Although this parameter guarantees IC operation, it does not guarantee all electrical characteristics.
THERMAL IMPEDANCE (TA = 25°C unless otherwise specified)
Symbol
Characteristic
Value
Unit
qJA
Junction−to−Ambient Thermal Impedance (Note 5)
100
°C/W
5. JEDEC recommended environment, JESD51−2, and test board, JESD51−3, with minimum land pattern.
ESD CAPABILITY
Symbol
Characteristic
Value
Unit
ESD
Human Body Model, ANSI/ESDA/JEDEC JS−001−2012 (Note 6)
4
kV
Charged Device Model, JESD22−C101 (Note 6)
2
6. Meets JEDEC standards ANSI/ESDA/JEDEC JS−001−2012 and JESD 22−C101.
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
SENSEFET SECTION
BVDSS
Drain−Source Breakdown Voltage
VCC = 0 V, ID = 250 mA
650
−
−
V
IDSS
Zero Gate Voltage Drain Current
VDS = 520 V, TA = 125°C
−
−
250
mA
RDS(ON)
Drain−Source On−State Resistance
VGS = 10 V, ID = 1 A
−
3.5
4.0
W
CISS
Input Capacitances
VGS = 0 V, VDS = 25 V, f = 1 MHz
−
290
−
pF
COSS
Output Capacitance
VGS = 0 V, VDS = 25 V, f = 1 MHz
−
45
−
pF
CRSS
Reverse Transfer Capacitance
VGS = 0 V, VDS = 25 V, f = 1 MHz
−
5.5
−
pF
tr
Rise Time
VDD = 350 V, ID = 3.5 A
−
22
−
ns
tf
Fall Time
VDD = 350 V, ID = 3.5 A
−
19
−
ns
CONTROL SECTION
fOSC
Switching Frequency
VCOMP = 2.5 V
45
50
55
kHz
fM
Frequency Modulation (Note 7)
VCOMP = 2.5 V, Randomly
−
±3
−
kHz
ton.max
Maximum Turn−On Time
VCOMP = 2.5 V
11.2
13.3
15.4
ms



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