The Embedded I/O Company

Technical Information

 Standard single-width 32 bit PMC module conforming

to IEEE P1386.1

 PCI 2.1 compliant interface

 3.3V and 5V PCI Signaling Voltage

 Board size: 149 mm x 74 mm

 TPMC632-1x: Xilinx XC6SLX45T-2 Spartan6 FPGA

configured by serial Flash XCF16PFS

TPMC632-2x: Xilinx XC6SLX100T-2 Spartan6 FPGA

configured by serial Flash XCF32PFS

 Flash device is programmable via JTAG and in-

system programmable

 FPGA clock options:

 Local clock generator as source for the FPGA

internal PLL

 1 DDR3 SDRAM bank, 64M x 16 (128 MB)

 32 Mbit SPI-EEPROM for User Data or FPGA

configuration

 I/O lines

64 TTL I/O, or 32 differential I/O or 32 TTL I/O

and 16 differential I/O

 TTL signaling voltage (maximum current: +/-

32mA), EIA-422/-485 signaling level

or M-LVDS Standard (TIA/EIA-899)

 direction individually programmable

 I/O access:

64 I/O lines on HD68 front connector, parallel to

up to 64 I/O lines on rear connector P14

 Operating temperature -40°C to +85°C

TEWS TECHNOLOGIES GmbH keeps the right to change technical specification without further notice.

All trademarks mentioned are property of their respective owners.

Issue 1.0.2

2017-08-31

TEWS TECHNOLOGIES GmbH

Am Bahnhof 7

25469 Halstenbek, Germany

Phone: +49 (0) 4101 4058 0

Fax: +49 (0) 4101 4058 19

e-mail: info@tews.com

www.tews.com