CMC02

2006-11-06

4

Device mounted on a glass-epoxy board

(board size:50 mm x 50 mm, soldering land 6 mm x 6 mm)

0

0

0.4

1.0

0.2

0.4

0.6

0.8

1.0

1.2

0.2

0.6

0.8

160

60

0

20

40

80

100

120

140

(V)

0

0.01

1

100

0.4

0.8

1.6

150°C

Tj = 25°C

75°C

2.0

0.1

10

1.2

0.2

0

0.4

0.6

1.0

0.8

1.2

Pulse test

0.001

1000

10

Ta

= 25°C

f

= 50 Hz

Time t (s)

Number of cycles

Surge forward current (non-repetitive)

1

0

10

100

30

10

40

Average forward current

(A)

Device mounted on a ceramic board

(board size: 50 mm x 50 mm, soldering land 2 mm x 2 mm)

0.2

0

0.4

0.6

1.0

0.8

1.2

160

60

0

20

40

80

100

120

140

0.1

100

1000

10

0.01

0.1

1

100

1.2

Conduction angle 180°

0°

180°

Halfsine waveform

20

1

Conduction angle 180°

0°

180°

Halfsine waveform

Conduction angle 180°

0°

180°

Halfsine waveform

Device mounted on a glass-epoxy board:

board size: 50 mm

× 50 mm,

soldering land: 2.1 mm

× 1.4 mm,

board thickness: 1.6 t

Device mounted on a glass-epoxy board:

board size: 50 mm

× 50 mm,

soldering land: 6.0 mm

× 6.0 mm,

board thickness: 1.6 t

Device mounted on a ceramic board:

board size: 50 mm

× 50 mm,

soldering land: 2.0 mm

× 2.0 mm,

board thickness: 0.64 t