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CUS01 Datasheet(PDF) 3 Page - Toshiba Semiconductor |
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CUS01 Datasheet(HTML) 3 Page - Toshiba Semiconductor |
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3 / 5 page ![]() CUS01 2006-11-13 3 Instantaneous forward voltage vF (V) iF – vF Average forward current IF (AV) (A) PF (AV) – IF (AV) Average forward current IF (AV) (A) Ta max – IF (AV) Average forward current IF (AV) (A) TI max – IF (AV) Time t (s) rth (j-a) – t 0.01 0.0 75°C 25°C Tj = 125°C 10 1 0.1 0.2 0.4 0.6 0.8 1.0 1 0.001 1000 0.01 0.1 1 10 100 1000 10 100 10000 (1) Device mounted on a ceramic board Soldering land: 2.0 mm × 2.0 mm (2) Device mounted on a glass-epoxy board Soldering land: 6.0 mm × 6.0 mm (3) Device mounted on a glass-epoxy board Standard Soldering pad (2) (3) (1) 0.5 0.0 0.0 Rectangular waveform 0.2 0.4 0.6 1.0 1.2 0.8 1.4 1.6 0.3 0.1 0.2 0.4 180° 120° DC α = 60° α 0° 360° Conduction angle: α 0 0.0 140 0.2 0.4 0.6 1.0 1.2 60 20 40 80 100 0.8 1.4 1.6 120 DC α = 180° Device mounted on a ceramic board (board size: 50 mm × 50 mm) Rectangular waveform α 0° 360° Conduction angle: α VR = 15 V 140 0 0.0 0.2 0.4 0.6 1.0 1.2 60 20 40 80 100 0.8 1.4 1.6 120 180° 120° DC α = 60° Rectangular waveform α 0° 360° Conduction angle: α VR = 15 V |
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