6

NXP Semiconductors

34845

4

Electrical characteristics

4.1

Absolute maximum ratings

Table 3. Absolute maximum ratings

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage

to the device.

Symbol

Ratings

Value

Unit

Notes

Electrical ratings

VMAX

Maximum Pin Voltages

• SWA, SWB, VOUT

• CH1, CH2, CH3, CH4, CH5, CH6 (Off state)

• CH1, CH2, CH3, CH4, CH5, CH6 (On state)

• FAIL

• OVP

• COMP, ISET

• PWM, WAKE

• EN, VIN

-0.3 to 65

-0.3 to 45

-0.3 to 20

-0.3 to 7.0

-0.3 to 7.75

-0.3 to 2.7

-0.3 to 5.5

-0.3 to 24

V

ILED_MAX

Maximum LED Current per Channel

33

mA

VESD

ESD Voltage

Human Body Model (HBM)

Machine Model (MM)

±2000

±200

V

(2)

Thermal ratings

TA

Operating Ambient Temperature Range

-40 to 85

°C

TJ

Maximum Junction Temperature

150

°C

TS

Storage Temperature Range

-40 to 150

°C

TPPRT

Peak Package Reflow Temperature During Reflow

Note 4

°C

(3), (4)

TθJA

Thermal Resistance Junction to Ambient

36

°C/W

(5)

TθJC

Thermal Resistance Junction to Case

3.1

°C/W

(6)

PD

Power Dissipation

• TA = 25 °C

• TA = 85 °C

3.4

1.8

W

(5)

Notes

2.

ESD testing is performed in accordance with the Human Body Model (HBM) (AEC-Q100-2) (CZAP = 100 pF, RZAP = 1500 Ω), and the Machine

Model (MM) (CZAP = 200 pF, RZAP = 0 Ω).

3.

Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause

malfunction or permanent damage to the device.

4.

NXP’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and

Moisture Sensitivity Levels (MSL), Go to www.nxp.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all

orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.

5.

Per JEDEC51-8 Standard for Multilayer PCB.

6.

Theoretical thermal resistance is from the die junction to the exposed pad.