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BMP280 Datasheet(PDF) 41 Page - Bosch Sensortec GmbH |
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BMP280 Datasheet(HTML) 41 Page - Bosch Sensortec GmbH |
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41 / 49 page  Bosch Sensortec | BMP280 Data sheet 41 | 49 Modifications reserved | Data subject to change without notice Document number: BST-BMP280-DS001-26 Revision_1.26_102021 7.4 Soldering guidelines The moisture sensitivity level of the BMP280 sensors corresponds to JEDEC Level 1, see also: • IPC/JEDEC J-STD-020C “Joint Industry Standard: Moisture/Reflow Sensitivity Classification for non- hermetic Solid State Surface Mount Devices” • IPC/JEDEC J-STD-033A “Joint Industry Standard: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices”. The sensor fulfils the lead-free soldering requirements of the above-mentioned IPC/JEDEC standard, i.e. reflow soldering with a peak temperature up to 260°C. The minimum height of the solder after reflow shall be at least 50µm. This is required for good mechanical decoupling between the sensor device and the printed circuit board (PCB). Figure 20: Soldering profile |
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