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ISL70001SEH Datasheet(PDF) 18 Page - Renesas Technology Corp

Part # ISL70001SEH
Description  Radiation Hardened and SEE Hardened 6A Synchronous Buck Regulator
PDF  24 Pages
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Manufacturer  RENESAS [Renesas Technology Corp]
Direct Link  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

ISL70001SEH Datasheet(HTML) 18 Page - Renesas Technology Corp

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ISL70001SEH, ISL70001SRH
FN7956 Rev 3.03
Page 18 of 23
Feb 5, 2024
Heatsink Mounting Guidelines
The R48.B package option has a heatsink mounted on the
underside of the package. The following JESD51-5 guidelines
may be used to mount the package:
1. Place a thermal land on the PCB under the heatsink.
2. The land should be approximately the same size as to 1mm
larger than the 9x9mm heat sink.
3. Place an array of thermal vias below the thermal land.
- Via array size: ~8 x 8 = 64 thermal vias
- Via diameter: ~0.3mm drill diameter with plated copper on
the inside of each via.
- Via pitch: ~1.2mm.
- Vias should drop to and contact as much buried metal area
as feasible to provide the best thermal relief.
Heatsink Electrical Potential
The heatsink is electrically isolated and unbiased. The heatsink
may be electrically connected to any potential, which offers the
best thermal relief through conductive mounting materials
(conductive epoxy, solder, etc.) or may be left unbiased through
the use of electrically non-conductive mounting materials
(non-conductive epoxy, Sil-pad, kapton film, etc.).
Weight Characteristics
Weight of Packaged Device
1.602 Grams typical - R48.A Package
2.440 Grams typical - R48.B Package
Die Characteristics
Die Dimensions
5720µm x 5830µm (225.2 mils x 229.5 mils)
Thickness: 483µm ± 25.4µm (19.0 mils ± 1 mil)
Interface Materials
GLASSIVATION
Type: Silicon Oxide and Silicon Nitride
Thickness: 0.3µm ± 0.03µm to 1.2µm ± 0.12µm
TOP METALLIZATION
Type: AlCu (0.5%)
Thickness: 2.7µm ±0.4µm
SUBSTRATE
Type: Silicon
Isolation: Junction
BACKSIDE FINISH
Silicon
ASSEMBLY RELATED INFORMATION
Substrate Potential - Package R48.A and R48.B: PGND
Metal Lid Potential
Electrically Isolated -Package R48.A
PGND - Package R48.B
ADDITIONAL INFORMATION
Worst Case Current Density
< 2 x 105 A/cm2
Transistor Count
25030
Layout Characteristics
Step and Repeat
5720µm x 5830µm
Connect PGND to PGNDx



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