| Electronic Components Datasheet Search |
|
ISL70001SEH Datasheet(PDF) 18 Page - Renesas Technology Corp |
|
|
|||||||||||||||||||||||||||||
ISL70001SEH Datasheet(HTML) 18 Page - Renesas Technology Corp |
|
18 / 24 page ![]() ISL70001SEH, ISL70001SRH FN7956 Rev 3.03 Page 18 of 23 Feb 5, 2024 Heatsink Mounting Guidelines The R48.B package option has a heatsink mounted on the underside of the package. The following JESD51-5 guidelines may be used to mount the package: 1. Place a thermal land on the PCB under the heatsink. 2. The land should be approximately the same size as to 1mm larger than the 9x9mm heat sink. 3. Place an array of thermal vias below the thermal land. - Via array size: ~8 x 8 = 64 thermal vias - Via diameter: ~0.3mm drill diameter with plated copper on the inside of each via. - Via pitch: ~1.2mm. - Vias should drop to and contact as much buried metal area as feasible to provide the best thermal relief. Heatsink Electrical Potential The heatsink is electrically isolated and unbiased. The heatsink may be electrically connected to any potential, which offers the best thermal relief through conductive mounting materials (conductive epoxy, solder, etc.) or may be left unbiased through the use of electrically non-conductive mounting materials (non-conductive epoxy, Sil-pad, kapton film, etc.). Weight Characteristics Weight of Packaged Device 1.602 Grams typical - R48.A Package 2.440 Grams typical - R48.B Package Die Characteristics Die Dimensions 5720µm x 5830µm (225.2 mils x 229.5 mils) Thickness: 483µm ± 25.4µm (19.0 mils ± 1 mil) Interface Materials GLASSIVATION Type: Silicon Oxide and Silicon Nitride Thickness: 0.3µm ± 0.03µm to 1.2µm ± 0.12µm TOP METALLIZATION Type: AlCu (0.5%) Thickness: 2.7µm ±0.4µm SUBSTRATE Type: Silicon Isolation: Junction BACKSIDE FINISH Silicon ASSEMBLY RELATED INFORMATION Substrate Potential - Package R48.A and R48.B: PGND Metal Lid Potential Electrically Isolated -Package R48.A PGND - Package R48.B ADDITIONAL INFORMATION Worst Case Current Density < 2 x 105 A/cm2 Transistor Count 25030 Layout Characteristics Step and Repeat 5720µm x 5830µm Connect PGND to PGNDx |
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |