5

CSD95481RWJ

www.ti.com

SLPS674 – JUNE 2017

Product Folder Links: CSD95481RWJ

Submit Documentation Feedback

Copyright © 2017, Texas Instruments Incorporated

(1)

θJB is determined with the device mounted on a 1-in

2 (6.45-cm2), 2-oz (0.071-mm) thick Cu pad on a 1.5-in × 1.5-in, 0.06-in (1.52-mm)

thick FR4 board based on hottest board temperature within 1 mm of the package.

6.4 Thermal Information

TA = 25°C (unless otherwise stated)

THERMAL METRIC

MIN

TYP

MAX

UNIT

θJC

Thermal resistance, junction-to-case (top of package)

7.4

°C/W

θJB

Thermal resistance, junction-to-board(1)

2.2

°C/W

ΨJT

Junction-to-top characterization parameter

0.9

°C/W