0

5

10

15

20

25

30

35

0

10

20

30

40

50

60

70

80

90

Ambient Temperature (ºC)

400LFM

200LFM

100LFM

Nat Conv

G001

0

5

10

15

20

25

30

35

0

20

40

60

80

100

120

140

Board Temperature (ºC)

VIN = 12V

VGS = 5V

VOUT = 1.3V

fSW = 500kHz

LOUT = 0.29µH

G001

0

1

2

3

4

5

6

7

8

1

4

7

10

13

16

19

22

25

28 30

Output Current (A)

VIN = 12V

VGS = 5V

VOUT = 1.3V

fSW = 500kHz

LOUT = 0.29µH

G001

0.5

0.6

0.7

0.8

0.9

1

1.1

−50

−25

0

25

50

75

100

125

150

Junction Temperature (ºC)

VIN = 12V

VGS = 5V

VOUT = 1.3V

fSW = 500kHz

LOUT = 0.29µH

G001

CSD87384M

www.ti.com

SLPS415D – SEPTEMBER 2013 – REVISED MARCH 2015

Max RθJA = 67°C/W

Max RθJA = 153°C/W

when mounted on

when mounted on

1 inch2 (6.45 cm2) of

minimum pad area of

2 oz. (0.071 mm thick)

2 oz. (0.071 mm thick)

Cu.

Cu.

5.6 Typical Power Block Device Characteristics

TJ = 125°C, unless stated otherwise. For Figure 3 and Figure 4, the Typical Power Block System Characteristic curves are

based on measurements made on a PCB design with dimensions of 4.0 inches (W) × 3.5 inches (L) × 0.062 inch (H) and 6

copper layers of 1 oz. copper thickness. See Application and Implementation for detailed explanation.

Figure 1. Power Loss vs Output Current

Figure 2. Normalized Power Loss vs Temperature

Figure 3. Safe Operating Area – PCB Horizontal Mount

Figure 4. Typical Safe Operating Area

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