4

LM2758

SNVS551E – APRIL 2008 – REVISED MAY 2016

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Copyright © 2008–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

All voltages are with respect to the potential to the GND pin.

(4)

For detailed soldering specifications and information, see AN-1112 DSBGA Wafer Level Chip Scale Package (SNVA009).

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2) (3)

MIN

MAX

UNIT

VIN, CPOUT pins: voltage to GND

–0.3

6

V

EN1, EN2 pins: Voltage to GND

–0.3

(VIN + 0.3) w/ 6 V

maximum

V

Continuous power dissipation

Junction temperature, TJ-MAX

150

°C

Maximum lead temperature (soldering)

See(4)

Storage temperature, Tstg

–65°C

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±200

(1)

All voltages are with respect to the potential at the GND pin.

(2)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operation junction temperature (TJ-MAX-OP =

125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the

part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Input voltage

2.7

5.5

V

Junction temperature, TJ

–40

125

°C

Ambient temperature, TA

(2)

–40

85

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.4 Thermal Information

THERMAL METRIC(1)

LM2758

UNIT

YZR (DSBGA)

12 PINS

RθJA

Junction-to-ambient thermal resistance

93.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

0.7

°C/W

RθJB

Junction-to-board thermal resistance

16.1

°C/W

ψJT

Junction-to-top characterization parameter

2.9

°C/W

ψJB

Junction-to-board characterization parameter

16.0

°C/W