TDA8026ETSLASHC3 datasheet(39/61 Pages) NXP

39 / 61 page

TDA8026_1

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Product data sheet

Rev. 1.1 — 30 June 2016

39 of 61

NXP Semiconductors

TDA8026

Multiple smart card slot interface IC

The fall time is calculated from 90 % to 10 % of the signal amplitude. The default setting

for IO_SR[0]/IO_SR[2] (low) and IO_SR[1]/IO_SR[3] (high) is LOW (see table Table 39 on

page 38).

8.11 Fault detection

The following fault conditions are monitored by the TDA8026.

• Overheating: All the card slots are automatically deactivated and the device is forced

in to Standby mode when the detected temperature range is between

125

C to 209 C. The card slot PROT bit is set to logic 1. Above 209 C the device is

shutdown.

• Card removal during transaction: A deactivation sequence is performed in

accordance with the EMV 4.2 standard.

• DC-to-DC converter overload: All card slots are automatically deactivated and the

device is placed in Standby mode when the current supplied by the DC-to-DC

converter exceeds 170 mA (ICC parameter for VCC(n)). The card slot PROT bit is set to

logic 1

• Card slot current limitation and deactivation: A current level drawn by a card

which exceeds 120 mA (Isd parameter for VCC(n)) triggers the deactivation sequence

on the faulty card slot. During the deactivation, the current is limited to approximately

110 mA. The card slot PROT bit is set to logic 1

• VDD or VDD(INTF) dropping: A voltage drop occurring on VDD or VDD(iNTF) generates

card slot deactivation followed by a device reset. The completion of this phase is

validated when the SUPL bits are set to logic 1.

TDA8026ET/C3 Datasheet(PDF) 39 Page - NXP Semiconductors