SoC

Bluetooth

Module

B1

VCCA

VCCB

DIR1

A1

0.7 V

3.3 V

0.1 µF

0.1 µF

SN74AXC2T245

GND

RX

TX

DIR2

OE

B2

A2

TX

RX

GPIO1

Pullup Resistors keep device disabled

during power up. OE input may also be

tied to GND to keep device enabled

21

SN74AXC2T245-Q1

www.ti.com

SCES908A – FEBRUARY 2020 – REVISED APRIL 2020

Product Folder Links: SN74AXC2T245-Q1

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9 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

9.1 Application Information

The SN74AXC2T245-Q1 device can be used in level-translation applications for interfacing devices or systems

operating at different interface voltages with one another. The SN74AXC2T245-Q1 device is ideal for use in

applications where a push-pull driver is connected to the data I/Os. The max data rate can be up to 380 Mbps

when device translates a signal from 1.8 V to 3.3 V.

One example application is shown in Figure 6, where the SN74AXC2T245-Q1 device is used to translate low

voltage UART signals from a CPU to a higher voltage signal to properly drive the inputs of a bluetooth module.

9.2 Typical Application

Figure 6. 2-Pin UART Application