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PIN ASSIGNMENTS

ADS8370

AGND

+VBD

BDGND

+VA

REFM

5

6

7

4

1

2

3

17

16

15

18

21

20

19

SB/2C

AGND

AGND

+VA

AGND

AGND

AGND

+VA

+VA

ADS8370

SLAS450 – JUNE 2005

TOP VIEW

Note:

The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

TERMINAL FUNCTIONS

PIN

I/O

DESCRIPTION

NAME

NO.

AGND

2, 4, 5, 15, 18, 19

–

Analog ground pins. AGND must be shorted to analog ground plane below the device.

BDGND

21

–

Digital ground for all digital inputs and outputs. BDGND must be shorted to the analog ground plane

below the device.

BUSY

22

O

Status output. This pin is high when conversion is in progress.

CONVST

25

I

Convert start. This signal is qualified with CS internally.

CS

26

I

Chip select

FS

27

I

Frame sync. This signal is qualified with CS internally.

+IN

11

I

Noninverting analog input channel

–IN

12

I

Inverting analog input channel

NC

10, 13

–

No connection

PD

28

I

Power down. Device resets and powers down when this signal is high.

REFIN

8

I

Reference (positive) input. REFIN must be decoupled with REFM pin using 0.1-

µF bypass capacitor

and 1-

µF storage capacitor.

REFM

7

I

Reference ground. To be connected to analog ground plane.

REFOUT

9

O

Internal reference output. Shorted to REFIN pin only when internal reference is used.

SB/2C

1

I

Straight binary or 2's complement output data format. When low the device output is straight binary

format; when high the device output is 2's complement format. See Table 1.

SCLK

24

I

Serial clock. Data is shifted onto SDO with the rising edge of this clock. This signal is qualified with CS

internally.

SDO

23

O

Serial data out. All bits except MSB are shifted out at the rising edge of SCLK.

+VA

3, 6, 14, 16, 17

–

Analog power supplies

+VBD

20

–

Digital power supply for all digital inputs and outputs.

7

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