5 Specifications

5.1 Absolute Maximum Ratings

MIN

MAX

UNIT

VCC

Supply voltage

–0.5

7

V

IIK

Input diode current

For VI < –0.5 V or VI > VCC + 0.5 V

±20

mA

IOK

Output diode current

For VO < –0.5 V or VO > VCC + 0.5 V

±20

mA

IO

Output source or sink current per output pin

For VO> –0.5 V or VO < VCC + 0.5 V

±25

mA

Continuous current through VCC or GND

±50

mA

TJ

Junction temperature

150

°C

Tstg

Storage temperature range

– 65

150

°C

Lead temperature (Soldering 10s) (SOIC - lead tips only)

300

°C

5.2 Recommended Operating Conditions

MIN

MAX

UNIT

VCC

Supply voltage range

HC types

2

6

V

HCT types

4.5

5.5

VI, VO

DC input or output voltage

0

VCC

V

Input rise and fall time

2 V

1000

ns

4.5 V

500

6 V

400

TA

Temperature range

–55

125

℃

5.3 Thermal Information

THERMAL METRIC

D (SOIC)

N (PDIP)

UNIT

16 PINS

16 PINS

RθJA

Junction-to-ambient thermal resistance

(1)

73

67

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

CD54HC4020, CD74HC4020, CD54HCT4020, CD74HCT4020

SCHS201D – FEBRUARY 1998 – REVISED AUGUST 2022

www.ti.com

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