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STA335BW Datasheet(PDF) 51 Page - STMicroelectronics |
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STA335BW Datasheet(HTML) 51 Page - STMicroelectronics |
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51 / 54 page ![]() STA335BW Package thermal characteristics 51/54 6 Package thermal characteristics Using a double layer PCB the thermal resistance junction to ambient with 2 GND copper area of 3x3 cm and with 16 via holes (see Figure 12) is 24 °C/W in natural air convection. The dissipated power within the device depends primarily on the supply voltage, load impedance and output modulation level. The max estimated dissipated power for the STA335BW is: Figure 12. Double layer PCB Rth j-amb with 2 GND copper area and with 16 via holes Figure 13 shows the Power Derating curve for the PSSO36 package with two copper areas on board 2 x 2 cm and 3 x 3 cm. Figure 13. PSSO36 power derating curve 2 x 20 W @ 8 Ω, 18 V Pd max ~ 4 W 2 x 10 W + 1 x 20 W @ 4 Ω, 8 Ω, 18 V Pd max < 5 W 2 x 15 W @ 16 Ω, 24 V Pd max ~ 3 W 0 1 2 3 4 5 6 7 8 0 20 40 60 80 100 120 140 160 0 1 2 3 4 5 6 7 8 0 20 40 60 80 100 120 140 160 Pd (W) Tamb ( °C) Copper Area 2x2 cm and via holes STA335BW PSSO36 Copper Area 3x3 cm and via holes |
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