5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VCC

Supply voltage range

– 0.5

7

V

IIK

Input clamp current

(2)

(VI < – 0.5 V or VI > VCC + 0.5 V)

± 20

mA

IOK

Output clamp current

(2)

(VO < – 0.5 V or VO > VCC + 0.5 V)

± 20

mA

IO

Output source or sink current per

output pin

(VO > – 0.5 V or VCC + 0.5 V)

± 25

mA

Continuous current through VCC or GND

± 50

mA

TJ

Junction temperature

150

°C

Tstg

Storage temperature

– 65

150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

5.2 Recommended Operating Conditions

(1)

MIN

MAX

UNIT

VCC

Supply voltage range

HC types

2

6

V

HCT types

4.5

5.5

VI, VO

DC input or output voltage

0

VCC

V

Input rise and fall time

2 V

1000

ns

4.5 V

500

6 V

400

TA

Temperature range

–55

125

℃

(1)

All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report

Implications of Slow or Floating SMOS Inputs, literature number SCBA004.

5.3 Thermal Information

THERMAL METRIC

D (SOIC)

N (PDIP)

NS (SOP)

UNIT

16 PINS

16 PINS

16 PINS

RθJA

Junction-to-ambient thermal resistance

(1)

73

67

64

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application

report.

CD54HC4040, CD74HC4040, CD54HCT4040, CD74HCT4040

SCHS203E – NOVEMBER 1998 – REVISED JULY 2022

www.ti.com

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