LM3444

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SNVS682D – NOVEMBER 2010 – REVISED DECEMBER 2015

6.5 Electrical Characteristics

All typical limits are for TJ = 25°C and all maximum and minimum limits apply over the full operating temperature range

(TJ = −40°C to 125°C). Minimum and maximum limits are specified through test, design, or statistical correlation. Typical

values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless

otherwise stated the following conditions apply: VCC = 12 V.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

VCC SUPPLY

IVCC

Operating supply current

1.58

2.25

mA

Rising threshold

7.4

7.7

VCC-UVLO

Falling threshold

6

6.4

V

Hysterisis

1

COFF

VCOFF

Time-out threshold

1.225

1.276

1.327

V

RCOFF

Off timer sinking impedance

33

60

Ω

tCOFF

Restart timer

180

µs

CURRENT LIMIT

VISNS

ISNS limit threshold

1.174

1.269

1.364

V

Leading edge blanking time

125

ns

tISNS

Current limit reset delay

180

µs

ISNS limit to GATE delay

ISNS = 0 to 1.75-V step

33

ns

CURRENT SENSE COMPARATOR

VFILTER

FILTER open circuit voltage

720

750

780

mV

RFILTER

FILTER impedance

1.12

M

Ω

VOS

Current sense comparator offset voltage

–4

0.1

4

mV

GATE DRIVE OUTPUT

VDRVH

GATE high saturation

IGATE = 50 mA

0.24

0.5

V

VDRVL

GATE low saturation

IGATE = 100 mA

0.22

0.5

Peak souce current

GATE = VCC/2

–0.77

IDRV

A

Peak sink current

GATE = VCC/2

0.88

Rise time

Cload = 1 nF

15

tDV

ns

Fall time

Cload = 1 nF

15

THERMAL SHUTDOWN

Thermal shutdown temperature

165

TSD

See (1)

°C

Thermal shutdown hysteresis

20

(1)

Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power

dissipation exists, special care must be paid to thermal dissipation issues in board design. In applications where high power dissipation

and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient

temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power dissipation

of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (RθJA), as

given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).

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