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3 - 39

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

Absolute Maximum Ratings

Outline Drawing

RF / IF Input (Vdd = +5V)

+13 dBm

LO Drive (Vdd = +5V)

+13 dBm

Vdd

5.5V

Continuous Pdiss (Ta = 85 °C)

(derate 2.64 mW/°C above 85 °C)

238 mW

Storage Temperature

-65 to +150 °C

Operating Temperature

-55 to +85 °C

NOTES:

1. ALL DIMENSIONS IN INCHES (MILLIMETERS)

2. ALL TOLERANCES ARE ±0.001 (0.025)

3. DIE THICKNESS IS 0.004 (0.100) BACKSIDE IS

GROUND

4. BOND PADS ARE 0.004 (0.100) SQUARE

5. BOND PAD SPACING, CTR-CTR: 0.006 (0.150)

6. BACKSIDE METALLIZATION: GOLD

7. BOND PAD METALLIZATION: GOLD

Standard

Alternate

GP-2

[2]

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] For alternate packaging information contact Hittite

Microwave Corporation.

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

HMC337

v02.1007

GaAs MMIC SUB-HARMONICALLY

PUMPED MIXER, 17 - 25 GHz