 |
Electronic Components Datasheet Search |
|
|
Electronic Components Datasheet Search |
|
TLV2341IPWLE Datasheet(PDF) 4 Page - Texas Instruments |
|
|
|||||||||||||||||||||||||||||
TLV2341IPWLE Datasheet(HTML) 4 Page - Texas Instruments |
|
|
4 / 53 page  TLV2341, TLV2341Y LinCMOS ™ PROGRAMMABLE LOW-VOLTAGE OPERATIONAL AMPLIFIERS SLOS110A – MAY 1992 – REVISED AUGUST 1994 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLV2341Y chip information This chip, when properly assembled, displays characteristics similar to the TLV2341. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 TYPICAL BONDING PADS: 4 × 4 MINIMUM TJmax = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. + – OUT IN + IN – VDD (7) (3) (2) (6) (4) GND (1) (5) OFFSET N1 OFFSET N2 (8) BIAS SELECT 48 55 (8) (7) (2) (1) (6) (5) (4) (3) |
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
English ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
