1996 Jun 06

5

Philips Semiconductors

Product specification

VHF power amplifier module

BGY43

Stability

The module is stable with a load VSWR up to 3:1 (all

phases) when operated within the following conditions:

Ruggedness

The module will withstand a load mismatch VSWR of 50:1

(all phases) for short period overload conditions, with drive

power and DC supply voltages at maximum values,

providing the combination does not result in the matched

RF output power rating being exceeded.

MOUNTING

To ensure good thermal transfer the module should be

mounted on a heatsink with a flat surface with

heat-conducting compound applied between module and

heatsink. If an isolation washer is used, heatsink

compound should be applied to both sides of the washer.

Burrs and thickening of the holes in the heatsink should be

removed and 3 mm bolts tightened to a torque of 0.5 Nm.

The leads of the devices may be soldered directly into a

circuit using a soldering iron with a maximum temperature

of 245

°C for not more than 10 seconds at a distance of at

least 1 mm from the plastic.

APPLICATION INFORMATION

Power rating

In general, it is recommended that the output power from

the module under nominal conditions should not exceed

16 W in order to provide an adequate safety margin under

fault conditions.

Output power control

The module is not designed to be operated over a wide

range of output power levels. The purpose of the output

power control is to set the nominal output power level.

The preferred method of output power control is by varying

the drive power between 30 and 200 mW. The next option