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TPS53014DGS Datasheet(PDF) 4 Page - Texas Instruments

Part # TPS53014DGS
Description  TPS53014 4.5-V to 28-V Input, D-CAP2™ synchronous buck controller
PDF  25 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

TPS53014DGS Datasheet(HTML) 4 Page - Texas Instruments

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TPS53014
SLVSBF1A – MAY 2012 – REVISED FEBRUARY 2019
www.ti.com
Product Folder Links: TPS53014
Submit Documentation Feedback
Copyright © 2012–2019, Texas Instruments Incorporated
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6 Specifications
6.1
Absolute Maximum Ratings
Operating under free-air temperature range (unless otherwise noted)
(1)
VALUE
UNIT
Input voltage range
VIN, EN
–0.3 to 30
V
VBST
–0.3 to 36
VBST - SW
–0.3 to 6
VFB
–0.3 to 6
SW
–0.3 to 30
SW (10 nsec transient)
–3.0 to 30
Output voltage range
DRVH
–2 to 36
V
DRVH - SW
–0.3 to 6
DRVL, VREG5, SS
–0.3 to 6
PGND
–0.3 to 0.3
TA
Operating ambient temperature range
–40 to 85
°C
TSTG
Storage temperature range
–55 to 150
°C
TJ
Junction temperature range
–40 to 150
°C
6.2 Recommended Operating Conditions
MIN
MAX
UNIT
Supply input voltage range
VIN
4.5
28
V
Input voltage range
VBST
–0.1
33.5
V
VBST - SW
–0.1
5.5
VFB
–0.1
5.5
EN
–0.1
28
SW
–1.0
28
Output Voltage range
DRVH
–1.0
33.5
V
DRVH - SW
–0.1
5.5
DRVL, VREG5, SS
–0.1
5.5
PGND
–0.1
0.1
TA
Operating free-air temperature
–40
85
°C
TJ
Operating junction temperature
–40
125
°C
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report (SPRA953).
6.3 Thermal Information
THERMAL METRIC(1)
TPS53014
UNITS
DGS (10 PINS)
θJA
Junction-to-ambient thermal resistance
172.2
°C/W
θJCtop
Junction-to-case (top) thermal resistance
44.0
°C/W
θJB
Junction-to-board thermal resistance
93.0
°C/W
ψJT
Junction-to-top characterization parameter
1.6
°C/W
ψJB
Junction-to-board characterization parameter
91.4
°C/W
θJCbot
Junction-to-case (bottom) thermal resistance
n/a
°C/W



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