PCA9549_1

© Koninklijke Philips Electronics N.V. 2006. All rights reserved.

Product data sheet

Rev. 01 — 11 July 2006

18 of 24

Philips Semiconductors

PCA9549

Fig 21. TSSOP24 package outline (SOT355-1)

UNIT

(1)

QZ

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

0.15

0.05

0.95

0.80

0.30

0.19

0.2

0.1

7.9

7.7

4.5

4.3

0.65

6.6

6.2

0.4

0.3

8

0

o

o

0.13

0.1

0.2

1

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

0.75

0.50

SOT355-1

MO-153

99-12-27

03-02-19

0.25

0.5

0.2

Z

e

112

24

13

pin 1 index

θ

A

Q

detail X

L

(A )

3

E

c

X

A

D

y

0

2.5

5 mm

scale

TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm

SOT355-1

A

max.

1.1