LP38501-ADJ, LP38503-ADJ

SNVS522I – AUGUST 2007 – REVISED AUGUST 2015

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Table of Contents

7.4

Device Functional Modes........................................ 14

1

Features .................................................................. 1

8

Application and Implementation ........................ 15

2

Applications ........................................................... 1

8.1

Application Information............................................ 15

3

Description ............................................................. 1

8.2

Typical Applications ............................................... 15

4

Revision History..................................................... 2

9

Power Supply Recommendations ...................... 18

5

Pin Configurations and Functions ....................... 3

10

Layout................................................................... 19

6

Specifications......................................................... 4

10.1

Layout Guidelines ................................................. 19

6.1

Absolute Maximum Ratings ...................................... 4

10.2

Layout Examples................................................... 19

6.2

ESD Ratings.............................................................. 4

11

Device and Documentation Support ................. 20

6.3

Recommended Operating Conditions ....................... 4

11.1

Documentation Support ........................................ 20

6.4

Thermal Information .................................................. 4

11.2

Community Resources.......................................... 20

6.5

Electrical Characteristics........................................... 5

11.3

Trademarks ........................................................... 20

6.6

Typical Characteristics .............................................. 7

11.4

Electrostatic Discharge Caution ............................ 20

7

Detailed Description .............................................. 9

11.5

Glossary ................................................................ 20

7.1

Overview ................................................................... 9

12

Mechanical, Packaging, and Orderable

7.2

Functional Block Diagrams ....................................... 9

Information ........................................................... 20

7.3

Feature Description................................................... 9

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision H (April 2013) to Revision I

Page

•

Added Device Information and Pin Configuration and Functions sections, ESD Rating and updated Thermal

Information tables, Feature Description, Device Functional Modes, Application and Implementation, Power Supply

Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable

Information sections; remove lead temp from Abs Max table (in POA); remove obsolete heatsinking content; update

thermal values ........................................................................................................................................................................ 1

•

Deleted obsolete heatsinking information for DDPAK/TO-263 package ............................................................................. 18

Changes from Revision G (April 2013) to Revision H

Page

•

Changed layout of National data sheet to TI format .............................................................................................................. 1

2

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