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TLV733P

www.ti.com

SBVS235C – OCTOBER 2014 – REVISED JULY 2019

Product Folder Links: TLV733P

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Copyright © 2014–2019, Texas Instruments Incorporated

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the

device product folder on www.ti.com.

(2)

Output voltages from 1.0 V to 3.3 V in 50-mV increments are available. Contact the factory for details and availability.

11 Device and Documentation Support

11.1 Device Support

11.1.1 Development Support

11.1.1.1 Evaluation Module

An evaluation module (EVM) is available to assist in the initial circuit performance evaluation using the TLV733.

The TLV73312PEVM-643 evaluation module (and related user guide) can be requested at the Texas Instruments

website through the product folders or purchased directly from the TI eStore.

11.1.2 Device Nomenclature

Table 4. Device Nomenclature(1)(2)

PRODUCT

VOUT

TLV733xx(x)Pyyyz(3)

xx(x) is the nominal output voltage. For output voltages with a resolution of 100 mV, two digits are used

in the ordering number; otherwise, three digits are used (for example, 28 = 2.8 V; 125 = 1.25 V).

P indicates an active output discharge feature. All members of the TLV733 family will actively discharge

the output when the device is disabled.

yyy is the package designator.

z is the package quantity. R is for reel (3000 pieces), T is for tape (250 pieces).

(3) indicates an alternative tape and reel orientation. 3 indicates that pin 1 is in quadrant 3. See the

Package Materials Information addendum for more information.

11.2 Documentation Support

11.2.1 Related Documentation

Texas Instruments, TLV73312PDQN-643 Evaluation Module user guide

11.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper

right corner, click on Alert me to register and receive a weekly digest of any product information that has

changed. For change details, review the revision history included in any revised document.

11.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective

contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of

Use.

TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration

among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help

solve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and

contact information for technical support.

11.5 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.