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PACKAGE OUTLINE

C

TYP

11.5 0.25

2.8 MAX

TYP

0.33

0.13

0 -8

6X 1.27

8X

0.51

0.31

2X

3.81

0.46

0.36

1.0

0.5

0.25

GAGE PLANE

A

NOTE 3

5.95

5.75

B

NOTE 4

7.6

7.4

(2.286)

(2)

4218796/A 09/2013

SOIC - 2.8 mm max height

DWV0008A

SOIC

NOTES:

1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed 0.15 mm, per side.

4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm, per side.

1

8

0.25

C A

B

5

4

AREA

PIN 1 ID

SEATING PLANE

0.1 C

SEE DETAIL A

TYPICAL

DETAIL A

SCALE 2.000

ISO6420, ISO6421

SLLSG12 – AUGUST 2025

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