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SN74LVC1G373

SCES528F – DECEMBER 2003 – REVISED MAY 2017

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Copyright © 2003–2017, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 3

6

Specifications......................................................... 4

6.1

Absolute Maximum Ratings ...................................... 4

6.2

ESD Ratings.............................................................. 4

6.3

Recommended Operating Conditions ....................... 5

6.4

Thermal Information .................................................. 5

6.5

Electrical Characteristics........................................... 6

6.6

Timing Requirements: TA = –40°C to +85°C ............ 6

6.7

Timing Requirements: TA = –40°C to +125°C .......... 6

6.8

Switching Characteristics: TA = –40°C to +85°C ...... 7

6.9

Switching Characteristics: TA = –40°C to +85°C ...... 7

6.10

Switching Characteristics: TA = –40°C to +125°C .. 8

6.11

Operating Characteristics........................................ 8

6.12

Typical Characteristics ............................................ 9

7

Parameter Measurement Information ................ 10

8

Detailed Description ............................................ 12

8.1

Overview ................................................................. 12

8.2

Functional Block Diagram ....................................... 12

8.3

Feature Description................................................. 12

8.4

Device Functional Modes........................................ 13

9

Application and Implementation ........................ 14

9.1

Application Information............................................ 14

9.2

Typical Application .................................................. 14

10

Power Supply Recommendations ..................... 16

11

Layout................................................................... 16

11.1

Layout Guidelines ................................................. 16

11.2

Layout Example .................................................... 16

12

Device and Documentation Support ................. 17

12.1

Documentation Support ........................................ 17

12.2

Receiving Notification of Documentation Updates 17

12.3

Community Resource............................................ 17

12.4

Trademarks ........................................................... 17

12.5

Electrostatic Discharge Caution ............................ 17

12.6

Glossary ................................................................ 17

13

Mechanical, Packaging, and Orderable

Information ........................................................... 17

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision E (September 2016) to Revision F

Page

•

Changed YZP Package pinout diagram and added YZP pin numbers in Pin Functions table .............................................. 3

•

Added Balanced High-Drive CMOS Push-Pull Outputs, Standard CMOS Inputs, Clamp Diodes, Partial Power Down

(Ioff), Over-voltage Tolerant Inputs ........................................................................................................................................ 12

•

Added Trace Example in Layout Example section............................................................................................................... 16

•

Added Documentation Support section ................................................................................................................................ 17

Changes from Revision D (December 2013) to Revision E

Page

•

Added Applications section, Device Information table, ESD Ratings table, Feature Description section, Device

Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout

section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information

section ................................................................................................................................................................................... 1

Changes from Revision C (May 2007) to Revision D

Page

•

Updated document to new TI data sheet format. ................................................................................................................... 1

•

Deleted Ordering Information table; see POA at the end of the data sheet........................................................................... 1

•

Updated operating temperature range. .................................................................................................................................. 5