CD74ACT151 datasheet(3/33 Pages) TI2

3 / 33 page

3 Pin Configuration and Functions

Figure 3-1. CD54ACT151 J Package; CD74ACT151

J, D, or PW Package; 16-Pin CDIP, SOIC or TSSOP

(Top View)

GND

PAD

Figure 3-2. CD74ACT151 BQB Package, 16-Pin

WQFN (Transparent Top View)

Pin Functions

I/O(1)

DESCRIPTION

NO.

NAME

Data input 3

Data input 2

Data input 1

Data input 0

Data output

Data output, inverted

Output strobe, active low

GND

—

Ground

Address select C

Address select B

Address select A

Data input 7

Data input 6

Data input 5

Data input 4

VCC

—

Positive supply

Thermal Pad(2)

—

The thermal pad can be connected to GND or left floating. Do not connect to any other

signal or supply

(1)

I = Input, O = Output, I/O = Input or Output, G = Ground, P = Power

(2)

BQB package only

www.ti.com

CD54ACT151, CD74ACT151

SCHS338B – MARCH 2003 – REVISED MAY 2025

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