4

LM7301

SNOS879I – AUGUST 1999 – REVISED MAY 2016

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Copyright © 1999–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

Applies to both single-supply and split-supply operation. Continuous short-circuit operation at elevated ambient temperature can result in

exceeding the maximum allowed junction temperature of 150°C.

(4)

The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX) − TA)/RθJA. All numbers apply for packages soldered directly into a PC board.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

Differential input voltage

15

V

Voltage at input and output pin

(V+) + 0.3

(V–) – 0.3

V

Supply voltage (V+

− V−)

35

V

Current at input pin

±10

mA

Current at output pin(3)

±20

mA

Current at power supply pin

25

mA

Junction temperature, TJ

(4)

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

JEDEC document JEP155 states that 2500-V HBM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2500

V

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics.

(2)

The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX) − TA)/RθJA. All numbers apply for packages soldered directly into a PC board.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

NOM

MAX

UNIT

Supply voltage

1.8

32

V

Operating temperature (2)

–40

85

°C

Package thermal resistance (RθJA)

(2)

5-pin SOT-23

325

325

°C/W

8-pin SOIC

165

165

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.4 Thermal Information

THERMAL METRIC(1)

LM7301

UNIT

DBV (SOT-23)

D (SOIC)

5 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

169

120

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

122

65

°C/W

RθJB

Junction-to-board thermal resistance

30

61

°C/W

ψJT

Junction-to-top characterization parameter

17

16

°C/W

ψJB

Junction-to-board characterization parameter

29

60

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W