1

2

3

6

5

4

GND PLANE

COUT1

OUT2

IN

EN2

VIN

TLV716

OUT1

GND

GND PLANE

EN1

VOUT1

CIN

VOUT2

COUT2

TLV716, TLV716P

SBVS217B – JUNE 2013 – REVISED NOVEMBER 2015

www.ti.com

10 Layout

10.1 Layout Guidelines

If used, place the input and output capacitors as close to the device pins as possible. To maximize AC

performance refer to Figure 27.

10.2 Layout Example

Figure 27. Layout Recommendation

10.3 Thermal Considerations

Thermal protection disables the output when the junction temperature rises to approximately 158°C, allowing the

device to cool. When the junction temperature cools to approximately 140°C, the output circuitry is again

enabled. Depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection

circuit may cycle on and off. This cycling limits the dissipation of the regulator, protecting it from damage as a

result of overheating.

Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate

heatsink. For reliable operation, junction temperature should be limited to 125°C maximum. To estimate the

margin of safety in a complete design, increase the ambient temperature until the thermal protection is triggered;

use worst-case loads and signal conditions. The ambient temperature at which thermal shutdown occurs on the

device is 33°C higher (158°C - 125°C) than the maximum recommended operating conditions.

The internal protection circuitry of the TLV716 and TLV716P is designed to protect against overload conditions.

This circuitry is not intended to replace proper PCB layout and heatsinking. Continuously running the device into

thermal shutdown degrades reliability.

10.4 Power Dissipation

The ability to remove heat from a die is different for each package type, presenting different considerations in the

printed-circuit-board (PCB) layout. The copper PCB area around the device that is free of other components

moves the heat from the device to ambient air. Performance data for JEDEC high-K boards are given in the

Thermal Information table. Using heavier copper increases effectiveness in removing heat from the device.

Power dissipation (PD) is equal to the product of the output current and the voltage drop across both output pass

elements, as shown in Equation 1:

PD = (VIN – VOUT1) × IOUT1 + (VIN – VOUT2) × IOUT2

(1)

14

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