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TLV316-Q1, TLV2316-Q1, TLV4316-Q1

SBOS845B – NOVEMBER 2016 – REVISED AUGUST 2017

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Product Folder Links: TLV316-Q1 TLV2316-Q1 TLV4316-Q1

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Copyright © 2016–2017, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Device Comparison Table..................................... 3

6

Pin Configuration and Functions ......................... 4

7

Specifications......................................................... 7

7.1

Absolute Maximum Ratings ...................................... 7

7.2

ESD Ratings ............................................................ 7

7.3

Recommended Operating Conditions ....................... 7

7.4

Thermal Information: TLV316-Q1 ............................. 8

7.5

Thermal Information: TLV2316-Q1 ........................... 8

7.6

Thermal Information: TLV4316-Q1 ........................... 8

7.7

Electrical Characteristics........................................... 9

7.8

Typical Characteristics: Table of Graphs ................ 10

7.9

Typical Characteristics ............................................ 11

8

Detailed Description ............................................ 14

8.1

Overview ................................................................. 14

8.2

Functional Block Diagram ....................................... 14

8.3

Feature Description................................................. 15

8.4

Device Functional Modes........................................ 16

9

Application and Implementation ........................ 17

9.1

Application Information............................................ 17

9.2

System Examples ................................................... 17

10

Power Supply Recommendations ..................... 18

10.1

Input and ESD Protection ..................................... 18

11

Layout................................................................... 19

11.1

Layout Guidelines ................................................. 19

11.2

Layout Example .................................................... 19

12

Device and Documentation Support ................. 20

12.1

Documentation Support ........................................ 20

12.2

Related Links ........................................................ 20

12.3

Community Resources.......................................... 20

12.4

Trademarks ........................................................... 20

12.5

Electrostatic Discharge Caution ............................ 21

12.6

Glossary ................................................................ 21

13

Mechanical, Packaging, and Orderable

Information ........................................................... 21

4 Revision History

Changes from Revision A (December 2016) to Revision B

Page

•

Corrected typo; changed part numbers from TLV314, TLV2314, and TLV4314 to TLV316-Q1, TLV2316-Q1, and

TLV4316-Q1 in Features section ........................................................................................................................................... 1

•

Changed values in the Thermal Information: TLV4316-Q1 table to align with JEDEC standards. ........................................ 8

Changes from Original (November 2016) to Revision A

Page

•

Changed the CDM ESD Classification Level from C6 to C5 in the Features section ............................................................ 1

•

Deleted the SC70 (5), SOIC (8), and SOIC (14) packages from the Device Information table ............................................ 1

•

Deleted the DCK (SC70) package from the TLV316-Q1 pinout diagram in the Pin Configurations and Functions

section ................................................................................................................................................................................... 4

•

Deleted the DCK (SC70) pinout information from the Pin Functions: TLV316-Q1 table in the Pin Configurations and

Functions section ................................................................................................................................................................... 4

•

Deleted D (SOIC) package from the TLV2316-Q1 pinout diagram in the Pin Configurations and Functions section .......... 5

•

Deleted the D (SOIC) package from TLV4316-Q1 pinout diagram in the Pin Configurations and Functions section ........... 6

•

Changed the ESD Ratings table from commercial to automotive specifications .................................................................. 7

•

Changed the CDM ESD rating from ±1500 to ±750 in the ESD Ratings table ..................................................................... 7

•

Deleted the DCK (SC70) package from the Thermal Information: TLV316-Q1 table in the Specifications section............... 8

•

Changed the formatting of all Thermal Information table notes ............................................................................................ 8

•

Deleted the D (SOIC) package from the Thermal Information: TLV2316-Q1 table in the Specifications section.................. 8

•

Deleted the D (SOIC) package from the Thermal Information: TLV4316-Q1 table in the Specifications section ................. 8

•

Deleted the static literature number in the SBOA128 application note reference in the EMI Susceptibility and Input

Filtering section..................................................................................................................................................................... 16

•

Deleted the static literature number in document reference in the Layout Guidelines section ........................................... 19

•

Changed the layout example image (Figure 41) in Layout Example section ....................................................................... 19

•

Deleted the static literature numbers from document references in Related Documentation section ................................ 20