5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Supply voltage,VIN

–0.3

6.0

V

Enable voltage, VEN

–0.3

6.0

V

Output voltage, VOUT

–0.3

VIN + 0.3(2)

V

Operating junction temperature range, TJ

–40

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

The absolute maximum rating is VIN + 0.3V or 6.0V, whichever is smaller

5.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±1000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±500

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500V HBM is possible with the necessary precautions.

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250V CDM is possible with the necessary precautions.

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VIN

Input voltage

1.45

5.5

V

VOUT

Output voltage

0.6

5.0

V

VEN

Enable voltage

0

5.5

V

IOUT

Output current

0

1

A

CIN

Input capacitor

1

µF

COUT

Output capacitor

1

200

µF

fEN

Enable toggle frequency

10

kHz

TJ

Junction temperature

–40

125

°C

TLV757P

SBVS322C – OCTOBER 2017 – REVISED MARCH 2024

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