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TLV9001UIDBVR.A Datasheet(PDF) 51 Page - Texas Instruments |
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TLV9001UIDBVR.A Datasheet(HTML) 51 Page - Texas Instruments |
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51 / 109 page  www.ti.com PACKAGE OUTLINE C 6X 0.65 2X 1.95 8X 0.38 0.25 5.05 4.75 TYP SEATING PLANE 0.15 0.05 0.25 GAGE PLANE 0 -8 1.1 MAX 0.23 0.13 B 3.1 2.9 NOTE 4 A 3.1 2.9 NOTE 3 0.7 0.4 VSSOP - 1.1 mm max height DGK0008A SMALL OUTLINE PACKAGE 4214862/A 04/2023 1 4 5 8 0.13 C A B PIN 1 INDEX AREA SEE DETAIL A 0.1 C NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-187. PowerPAD is a trademark of Texas Instruments. A 20 DETAIL A TYPICAL SCALE 4.000 |
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