6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VIN1 ,2

Input Voltage

–0.3

6

V

VOUT1,2

Output Voltage

–0.3

6

V

VON1,2

ON Pin Voltage

–0.3

6

V

VBIAS

Bias Voltage

–0.3

6

V

IMAX

Maximum continuous current per channel

6

A

IMAX,PLS

Maximum pulsed current switch per channel, pulse <300µs, 3% duty

cycle

8

A

TJ

Junction temperature

125

°C

Tstg

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated

under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/

JEDEC JS-001, all pins(1)

±2000

V

Charged device model (CDM), per JEDEC

specification JESD22-C101, all pins(2)

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VIN1,2

Input Voltage

0.6

VBIAS

V

VBIAS

Bias Voltage

2.5

5.7

V

VON1,2

ON Pin Voltage

0

5.7

V

VOUT1,2

Output Voltage

0

VIN

V

VIH

High-Level Input Voltage, ON

1.2

5.7

V

VIL

Low-Level Input Voltage, ON

0

0.5

V

TA

Ambient Temperature

–40

105

°C

6.4 Thermal Information

THERMAL METRIC(1)

TPS22976

UNIT

DPU (WSON)

14 PINS

RθJA

Junction-to-ambient thermal resistance

50.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

52.3

°C/W

RθJB

Junction-to-board thermal resistance

18.4

°C/W

ΨJT

Junction-to-top characterization parameter

1.6

°C/W

ΨJB

Junction-to-board characterization parameter

18.6

°C/W

TPS22976

SLVSDE7D – NOVEMBER 2016 – REVISED DECEMBER 2023

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