This Data Sheet may be revised by subsequent versions

©2004 Eon Silicon Solution, Inc., www.essi.com.tw

or modifications due to changes in technical specifications.

18

EN25F80

Rev. E, Issue Date: 2007/11/23

Figure 16. Release Power-down Instruction Sequence Diagram

Figure 17. Release Power-down / Device ID Instruction Sequence Diagram

Read Manufacturer / Device ID (90h)

The Read Manufacturer/Device ID instruction is an alternative to the Release from Power-down /

Device ID instruction that provides both the JEDEC assigned manufacturer ID and the specific

device ID.

The Read Manufacturer/Device ID instruction is very similar to the Release from Power-down /

Device ID instruction. The instruction is initiated by driving the CS# pin low and shifting the

instruction code “90h” followed by a 24-bit address (A23-A0) of 000000h. After which, the Manufac-

turer ID for Eon (1Ch) and the Device ID are shifted out on the falling edge of CLK with most

significant bit (MSB) first as shown in Figure 17. The Device ID values for the EN25F80 are listed in

Table 5. If the 24-bit address is initially set to 000001h the Device ID will be read first