EMIF06-10006C2

Package information

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Figure 14.

Flip-Chip Tape and reel specification

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Note:

Note: More packing information is available in the application notes:

AN1235: “Flip-Chip: Package description and recommendations for use”

AN1751: "EMI Filters: Recommendations and measurements"

Dot identifying Pin A1 location

User direction of unreeling

All dimensions in mm

4 +/- 0.1

4 +/- 0.1

Ø 1.5 +/- 0.1

0.73 +/- 0.05